Specific Process Knowledge/Thin film deposition: Difference between revisions

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{| {{table}}
{| {{table}}
| align="left" valign="top"  style="background:LightGray"|''' Semiconductors'''
| align="left" valign="top"  style="background:LightGray"|''' Semiconductors'''
| align="left" valign="top" style="background:#DCDCDC;"|''' Oxides'''
| align="left" valign="top" style="background:#DCDCDC"|''' Oxides'''
| align="left" valign="top" style="background:LightGray"|''' Nitrides'''
| align="left" valign="top" style="background:LightGray"|''' Nitrides'''
| align="left" valign="top" style="background:#DCDCDC;"|''' Metals'''
| align="left" valign="top" style="background:#DCDCDC"|''' Carbon and Carbides'''
| align="left" valign="top" style="background:LightGray"|''' Alloys'''
| align="left" valign="top" style="background:LightGray"|''' Metals'''
| align="left" valign="top" style="background:#DCDCDC;"|''' Transparent conductive oxides'''
| align="left" valign="top" style="background:#DCDCDC"|''' Alloys'''
| align="left" valign="top" style="background:LightGray"|''' Polymers'''
| align="left" valign="top" style="background:LightGray"|''' Transparent conductive oxides'''
| align="left" valign="top" style="background:#DCDCDC;"|''' Multilayers'''
| align="left" valign="top" style="background:#DCDCDC"|''' Polymers'''
| align="left" valign="top" style="background:LightGray"|''' Multilayers'''
|-valign="top"
|-valign="top"


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|style="background: #DCDCDC"|
|style="background: #DCDCDC"|
[[/Deposition of Carbon|Carbon]] - ''and oxynitride'' <br/>
[[/Deposition of Titanium Carbide|Titanium Carbide (TiC)]] - ''conductive ceramics'' <br/>
[[/Deposition of Silicon Carbide|Silicon Carbide (SiC)]]<br/>
|style="background: LightGray"|
[[/Deposition of Aluminium|Aluminium]] <br/>
[[/Deposition of Aluminium|Aluminium]] <br/>
[[/Deposition of Chromium|Chromium]]<br/>
[[/Deposition of Chromium|Chromium]]<br/>
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|style="background: #DCDCDC"|
[[/Sputter deposition of metals and alloys|AlCu]]<br/>
[[/Sputter deposition of metals and alloys|AlCu]]<br/>
[[/Sputter deposition of metals and alloys|CoFe]]<br/>
[[/Sputter deposition of metals and alloys|CoFe]]<br/>
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[[/Sputter deposition of oxides and other compounds|YSZ]] (Yttrium stabilized zirconia)<br/>
[[/Sputter deposition of oxides and other compounds|YSZ]] (Yttrium stabilized zirconia)<br/>


|style="background: #DCDCDC"|
|style="background: LightGray"|
[[/Deposition of ITO|ITO (Tin doped Indium Oxide)]]<br/>
[[/Deposition of ITO|ITO (Tin doped Indium Oxide)]]<br/>
[[/Deposition of AZO |AZO (Aluminum doped Zinc Oxide)]]<br/>
[[/Deposition of AZO |AZO (Aluminum doped Zinc Oxide)]]<br/>


|style="background: LightGray"|
|style="background: #DCDCDC"|
[[Specific Process Knowledge/Lithography/SU-8|SU-8]]<br/>
[[Specific Process Knowledge/Lithography/SU-8|SU-8]]<br/>
[[Specific Process Knowledge/Thin film deposition/MVD#Processing on the MVD| Antistiction coating]] <br/>
[[Specific Process Knowledge/Thin film deposition/MVD#Processing on the MVD| Antistiction coating]] <br/>

Revision as of 21:41, 15 December 2022

3rd Level - Material/Method

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Choose material to deposit

Semiconductors Oxides Nitrides Carbon and Carbides Metals Alloys Transparent conductive oxides Polymers Multilayers

Silicon
Germanium
Diamond

Aluminium Oxide (Al2O3)
Barium titanate (BaTiO3)
Chromium Oxide (Cr2O3)
Hafnium Oxide (HfO2)
Magnesium Oxide (MgO)
Nickel Oxide (NiO)
Silicon Oxide (SiO2)
Titanium Oxide (TiO2)
Tantalum Oxide (Ta2O5)
Vanadium Oxide (VOx)
Zinc Oxide (ZnO)


Silicon Nitride - and oxynitride
Titanium Nitride - conductive ceramics
Aluminum Nitride (AlxNy)


Carbon - and oxynitride
Titanium Carbide (TiC) - conductive ceramics
Silicon Carbide (SiC)


Aluminium
Chromium
Cobalt
Copper
Gold
Iron
Magnesium
Molybdenum
Nickel
Niobium
Palladium
Platinum
Ruthenium
Silver
Tantalum
Tin
Titanium
Tungsten
Zinc


AlCu
CoFe
CuTi
FeMn
MnIr
NbTi
NiCo
NiFe
NiV alloy
TiW alloy (10%/90% by weight)

And an electroceramic:

YSZ (Yttrium stabilized zirconia)

ITO (Tin doped Indium Oxide)
AZO (Aluminum doped Zinc Oxide)

SU-8
Antistiction coating
Topas
PMMA

CrSi bilayer

Oh no! My material is not on the list! Please contact the Thin Film group if you would like to inquire about a material that is not mentioned here.

Choose deposition equipment

PVD LPCVD PECVD ALD Coaters Others



  • ALD1 - Atomic Layer Deposition (thermal)
  • ALD2 (PEALD) - Atomic Layer Deposition (thermal and plasma enhanced)

See the Lithography/Coaters page for coating polymers