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Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300: Difference between revisions

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Bghe (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, Bureaucrats, Administrators
7,318 edits
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*Ar sputter etch of various materials. For example many metals and alloys.  
*Ar sputter etch of various materials. For example many metals and alloys.  
*Reactive Ion beam etch using F
*Reactive Ion beam etch using F
*Sputter deposition of for example high quality optical layers
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*CHF<sub>3</sub>: 0-100 sccm
*CHF<sub>3</sub>: 0-100 sccm
*N<sub>2</sub>: 0-1000 sccm
*N<sub>2</sub>: 0-1000 sccm
Deposition source:
*Ar: 0-40 sccm
*O<sub>2</sub>: 0-100 sccm
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|style="background:LightGrey; color:black"|Chamber temperature
|style="background:LightGrey; color:black"|Chamber temperature
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