Specific Process Knowledge/Etch/DRIE-Pegasus/processA: Difference between revisions
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== Process A acceptance test== | == Process A acceptance test== | ||
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Process A is labelled Large trench (80μm wide) 150μm depth. In the acceptance test the process was run on a 150 mm SPTS wafer with 12-13 % etch load. | Process A is labelled Large trench (80μm wide) 150μm depth. In the acceptance test the process was run on a 150 mm SPTS wafer with 12-13 % etch load. | ||