Specific Process Knowledge/Thermal Process/C4 Aluminium Anneal furnace: Difference between revisions

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Aluminium Anneal furnace (C4)

The Aluminium Anneal furnace (C4) is a Tempress horizontal furnace for annealing of silicon wafers with aluminium or ALD oxides Al₂O₃ and TiO₂.

This furnace is the lowest of the furnace tubes in the furnace C-stack positioned in cleanroom B-1. In this furnace allowed to process wafers that contain aluminium. Please check the cross contamination information in LabManager, before you use the furnace.

The user manual, technical information and contact information can be found in LabManager:

Aluminium Anneal furnace (C4)

Process knowledge

Annealing: look at the Annealing page

Overview of the performance of Aluminium Anneal furnace and some process related parameters

Purpose		Annealing of wafers with aluminium Annealing of wafers with Al₂O₃ and TiO₂ deposited by ALD
Process parameter range	Process Temperature	Normally 350-550 ^oC
	Process pressure	1 atm
	Gas flows	N₂: 0-10 slm
Substrates	Batch size	1-30 100 mm wafers (or 50 mm wafers)
Substrates	Substrate materials allowed	Silicon wafers with aluminium. Silicon wafers with Al₂O₃ and TiO₂ deposited by ALD Wafers are allowed enter the furnace after aluminium lift-off or after aluminium etch and resist strip in acetone

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 [[Category: Equipment |Thermal C4]]
 [[Category: Thermal process|C4]]
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 ==Aluminium Anneal furnace (C4)==
-[[Image:C4helstak.jpg |thumb|300x300px|Aluminium Anneal furnace (C4). Positioned in cleanroom B-1]]
+[[Image:C4helstak.jpg |thumb|300x300px|Aluminium Anneal furnace (C4). Positioned in cleanroom B-1/ Photo: DTU Nanolab internal]]
 The Aluminium Anneal furnace (C4) is a Tempress horizontal furnace for annealing of silicon wafers with aluminium or ALD oxides Al<sub>2</sub>O<sub>3</sub> and TiO<sub>2</sub>.