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Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Thermal evaporation of Cr in Thermal evaporator: Difference between revisions

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Eves (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,346 edits
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[[image:eves_20210126_Cr_thermal_evaporator_09.png|center|300x300px|thumb|Figure 10. Thickness distribution across 6" wafer. Measurement is performed using [[Specific_Process_Knowledge/Characterization/Profiler#Dektak_XTA_stylus_profiler|Dektak profilometer]].]]
[[image:eves_20210126_Cr_thermal_evaporator_09.png|center|300x300px|thumb|Figure 80. Thickness distribution across 6" wafer. Measurement is performed using [[Specific_Process_Knowledge/Characterization/Profiler#Dektak_XTA_stylus_profiler|Dektak profilometer]].]]


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<gallery caption="" widths="500px" heights="400px" perrow="1">
<gallery caption="" widths="500px" heights="400px" perrow="1">
image:eves_Cr_retraction.png|Figure 11. Cr retraction from the tingsten rod at the end of lifetime.  
image:eves_Cr_retraction.png|Figure 9. Cr retraction from the tingsten rod at the end of lifetime.  
</gallery>
</gallery>


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