Specific Process Knowledge/Thermal Process/RTP Jipelec 2: Difference between revisions
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|style="background:LightGrey; color:black"|Gases on the system | |style="background:LightGrey; color:black"|Gases on the system | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
Process gases: | |||
*N<sub>2</sub> | *N<sub>2</sub> | ||
*Ar | |||
*Forming gas (4 % H<sub>2</sub>/96 % <sub>N2</sub>) - Not connected yet | |||
Purge gas: | |||
*N<sub>2</sub> pro | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates | ||
|style="background:LightGrey; color:black"|Batch size | |style="background:LightGrey; color:black"|Batch size | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
*200 mm wafers | *200 mm wafers | ||
*150 mm wafers | *150 mm wafers | ||
*100 mm wafers | *100 mm wafers (always placed on a susceptor or dummy wafer) | ||
*50 mm wafers | *50 mm wafers (always placed on a susceptor or dummy wafer) | ||
*Small samples | *Small samples | ||
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