Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions

Revision as of 11:18, 14 December 2020

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Click here to access older configurations.

The current configuration is

**Currently valid from November 2020 onwards**
Item	The currently applied modification	Comments
Available gasses and gas chemistry	Available gasses: SF₆: 50 sccm O₂: 50 sccm Ar: 283 N₂: 500 sccm He: 11 sccm Not available: C₄F₈ (H₂ currently fitted but closed) : 0 sccm CO₂: (It is not in the software)	OnlySF₆ and O₂ are used for Si, PR, and Cr etch. The rest is only make-up
Plasma source heaters	. Plenum Heater Inner Heater Magnetic Confinement Heater Chamber Heater	The temperature on the heaters in the plasma source are set to 20 degrees with a high tolerance. This essentially corresponds to powered off compared to default Pegasus temperatures which are in the 120-140 degrees range.
RF power and pressure settings	All recipes run without coil power, very low platen power and low pressures	None of the recipes use coil power in order to prevent aluminium fluoride formation at the aluminium oxide dome. These particles may drop on the wafer or chuck and cause abnormalitites. Most of the recipes

Pegasus 2 configuration table version 1

@@ Line 31: / Line 31: @@
 * CO<sub>2</sub>: (It is not in the software)
 |ItemComment=OnlySF<sub>6</sub> and O<sub>2</sub> are used for Si, PR, and Cr etch. The rest is only make-up
+}}
+{{Template:Peg2configcontent1
+|ItemName= Plasma source heaters
+|ItemConfiguration=.
+* Plenum Heater
+* Inner Heater
+* Magnetic Confinement Heater
+* Chamber Heater
+|ItemComment= The temperature on the heaters in the plasma source are set to 20 degrees with a high tolerance. This essentially corresponds to powered off compared to default Pegasus temperatures which are in the 120-140 degrees range.}}
+{{Template:Peg2configcontent1
+|ItemName= RF power and pressure settings
+|ItemConfiguration= All recipes run without coil power, very low platen power and low pressures
+|ItemComment=None of the recipes use coil power in order to prevent aluminium fluoride formation at the aluminium oxide dome. These particles may drop on the wafer or chuck and cause abnormalitites.
+Most of the recipes
 }}
 |}