Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
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* CO<sub>2</sub>: (It is not in the software) | * CO<sub>2</sub>: (It is not in the software) | ||
|ItemComment=OnlySF<sub>6</sub> and O<sub>2</sub> are used for Si, PR, and Cr etch. The rest is only make-up | |ItemComment=OnlySF<sub>6</sub> and O<sub>2</sub> are used for Si, PR, and Cr etch. The rest is only make-up | ||
}} | |||
{{Template:Peg2configcontent1 | |||
|ItemName= Plasma source heaters | |||
|ItemConfiguration=. | |||
* Plenum Heater | |||
* Inner Heater | |||
* Magnetic Confinement Heater | |||
* Chamber Heater | |||
|ItemComment= The temperature on the heaters in the plasma source are set to 20 degrees with a high tolerance. This essentially corresponds to powered off compared to default Pegasus temperatures which are in the 120-140 degrees range.}} | |||
{{Template:Peg2configcontent1 | |||
|ItemName= RF power and pressure settings | |||
|ItemConfiguration= All recipes run without coil power, very low platen power and low pressures | |||
|ItemComment=None of the recipes use coil power in order to prevent aluminium fluoride formation at the aluminium oxide dome. These particles may drop on the wafer or chuck and cause abnormalitites. | |||
Most of the recipes | |||
}} | }} | ||
|} | |} | ||