Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
| Line 21: | Line 21: | ||
{{Template:Peg2configcontent1 | {{Template:Peg2configcontent1 | ||
|ItemName= Available gasses and gas chemistry | |ItemName= Available gasses and gas chemistry | ||
|ItemConfiguration= | |ItemConfiguration= <br> | ||
* SF<sub>6</sub>: 50 sccm | * SF<sub>6</sub>: 50 sccm | ||
* O2: 50 sccm | * O2: 50 sccm | ||
| Line 31: | Line 30: | ||
|ItemComment=OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up | |ItemComment=OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up | ||
}} | }} | ||
=== Access to Pegasus 2 configuration templates === | === Access to Pegasus 2 configuration templates === | ||
Revision as of 10:24, 14 December 2020
Feedback to this page: click here
This system is a research tool and not available to the users
If you want to get access to the tool, then talk to professor Henry Jansen
Current setup and rules on Pegasus 2
Click here to access older configurations.
The current configuration is
Access to Pegasus 2 configuration templates
Pegasus 2 configuration table version 1
- Table header: Template:Peg2configheader1
- Table content: Template:Peg2configcontent1
| Item | The currently applied modification | Comments |
|---|---|---|
| Available gasses and gas chemistry |
|
OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up |