Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
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{{Template:Peg2configcontent1 | {{Template:Peg2configcontent1 | ||
|ItemName= Available gasses and gas chemistry | |ItemName= Available gasses and gas chemistry | ||
|ItemConfiguration= | |ItemConfiguration= <br> | ||
* SF<sub>6</sub>: 50 sccm | * SF<sub>6</sub>: 50 sccm | ||
* O2: 50 sccm | * O2: 50 sccm | ||
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|ItemComment=OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up | |ItemComment=OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up | ||
}} | }} | ||
=== Access to Pegasus 2 configuration templates === | === Access to Pegasus 2 configuration templates === | ||