Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
| Line 23: | Line 23: | ||
|ItemConfiguration= | |ItemConfiguration= | ||
{| | {| | ||
| colspan="3 "| C<sub>4</sub>F<sub>8</sub> (H2 currently fitted but closed) : 0 sccm | <-- | colspan="3 "| C<sub>4</sub>F<sub>8</sub> (H2 currently fitted but closed) : 0 sccm /--> | ||
|- | |- | ||
| SF6: 50 sccm | | SF6: 50 sccm | ||
Revision as of 10:16, 14 December 2020
Feedback to this page: click here
This system is a research tool and not available to the users
If you want to get access to the tool, then talk to professor Henry Jansen
Current setup and rules on Pegasus 2
Click here to access older configurations.
The current configuration is
| Item | The currently applied modification | Comments |
|---|---|---|
| Available gasses and gas chemistry | { | OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up
{ |
Access to Pegasus 2 configuration templates
Pegasus 2 configuration table version 1
- Table header: Template:Peg2configheader1
- Table content: Template:Peg2configcontent1