Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
| Line 22: | Line 22: | ||
|ItemName= Available gasses and gas chemistry | |ItemName= Available gasses and gas chemistry | ||
|ItemConfiguration= | |ItemConfiguration= | ||
{| C<sub>4</sub>F<sub>8</sub> (H2 currently fitted but closed) : 0 sccm | {| border="0" cellpadding="1" cellspacing="1" | ||
| colspan="3"| C<sub>4</sub>F<sub>8</sub> (H2 currently fitted but closed) : 0 sccm | |||
|- | |||
| SF6: 50 sccm | | SF6: 50 sccm | ||
| O2: 50 sccm | | O2: 50 sccm | ||
| Ar: 283 sccm | |||
|- | |- | ||
| N2: 500 sccm | | N2: 500 sccm | ||
| He: 11 sccm | | He: 11 sccm | ||
| CO2: (It is not in the software) | |||
|- | |- | ||
|} | |} | ||
|ItemComment=OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up | |ItemComment=OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up | ||
Revision as of 08:11, 14 December 2020
Feedback to this page: click here
This system is a research tool and not available to the users
If you want to get access to the tool, then talk to professor Henry Jansen
Current setup and rules on Pegasus 2
Click here to access older configurations.
The current configuration is
| Item | The currently applied modification | Comments |
|---|---|---|
| Available gasses and gas chemistry | { | OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up |
Access to Pegasus 2 configuration templates
Pegasus 2 configuration table version 1
- Table header: Template:Peg2configheader1
- Table content: Template:Peg2configcontent1