Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2: Difference between revisions
| Line 22: | Line 22: | ||
|ItemName= Available gasses and gas chemistry | |ItemName= Available gasses and gas chemistry | ||
|ItemConfiguration= | |ItemConfiguration= | ||
* C<sub>4< | * C<sub>4</sub>F<sub>8</sub> (H2 currently fitted but closed) : 0 sccm | ||
* SF6: 50 sccm | * SF6: 50 sccm | ||
* O2: 50 sccm | * O2: 50 sccm | ||
Revision as of 15:10, 11 December 2020
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This system is a research tool and not available to the users
If you want to get access to the tool, then talk to professor Henry Jansen
Current setup and rules on Pegasus 2
Click here to access older configurations.
The current configuration is
| Item | The currently applied modification | Comments |
|---|---|---|
| Available gasses and gas chemistry | * C4F8 (H2 currently fitted but closed) : 0 sccm
|
OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up |
Access to Pegasus 2 configuration templates
Pegasus 2 configuration table version 1
- Table header: Template:Peg2configheader1
- Table content: Template:Peg2configcontent1