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Specific Process Knowledge/Thin film deposition: Difference between revisions

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→Choose material to deposit: added new intermediate page on sputter deposition of metals and alloys
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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
1,760 edits
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[[/Lesker|AlCu]]<br/>
[[/Sputter deposition of metals and alloys|AlCu]]<br/>
[[/Lesker|CoFe]]<br/>
[[/Sputter deposition of metals and alloys|CoFe]]<br/>
[[/Lesker|CuTi]]<br/>
[[/Sputter deposition of metals and alloys|CuTi]]<br/>
[[/Lesker|FeMn]]<br/>
[[/Sputter deposition of metals and alloys|FeMn]]<br/>
[[/Lesker|MnIr]]<br/>
[[/Sputter deposition of metals and alloys|MnIr]]<br/>
[[/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Process information|NbTi]] <br/>
[[/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Process information|NbTi]] <br/>
[[/Lesker|NiCo]]<br/>
[[/Sputter deposition of metals and alloys|NiCo]]<br/>
[[/Deposition of NiFe|NiFe]]<br/>
[[/Deposition of NiFe|NiFe]]<br/>
[[/Deposition of NiV|NiV]] alloy <br/>
[[/Deposition of NiV|NiV]] alloy <br/>
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And an electroceramic:
And an electroceramic:


[[/Lesker|YSZ]] (Yttrium stabilized zirconia)<br/>
[[/Sputter deposition of metals and alloys|YSZ]] (Yttrium stabilized zirconia)<br/>


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