Specific Process Knowledge/Thin film deposition: Difference between revisions

Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3) - Cluster-based multi-chamber high vacuum sputtering deposition system
Lesker - Sputter tool
Wordentec - E-beam evaporator, sputter and thermal evaporator
Thermal evaporator
E Beam Evaporator (Temescal)
Physimeca - E-beam evaporator
IBE/IBSD Ionfab 300 - Sputter deposition of high quality optical layers and milling/etching
Sputter coater 03 - Gold sputtering system
Sputter coater 04 - Gold sputtering system

See the Lithography/Coaters page for coating polymers

MVD - Molecular Vapor Deposition
Electroplating-Ni - Electrochemical deposition of nickel
Electroplating-Cu - Electrochemical deposition of copper
MOCVD - Epitaxial growth - Ask the department of photonics if you are interested: Elizaveta Semenova or Kresten Yvind

@@ Line 60: / Line 60: @@
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-[[/Lesker|AlCu]]<br/>
+[[/Sputter deposition of metals and alloys|AlCu]]<br/>
-[[/Lesker|CoFe]]<br/>
+[[/Sputter deposition of metals and alloys|CoFe]]<br/>
-[[/Lesker|CuTi]]<br/>
+[[/Sputter deposition of metals and alloys|CuTi]]<br/>
-[[/Lesker|FeMn]]<br/>
+[[/Sputter deposition of metals and alloys|FeMn]]<br/>
-[[/Lesker|MnIr]]<br/>
+[[/Sputter deposition of metals and alloys|MnIr]]<br/>
 [[/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Process information|NbTi]] <br/>
-[[/Lesker|NiCo]]<br/>
+[[/Sputter deposition of metals and alloys|NiCo]]<br/>
 [[/Deposition of NiFe|NiFe]]<br/>
 [[/Deposition of NiV|NiV]] alloy <br/>
@@ Line 73: / Line 73: @@
 And an electroceramic:
-[[/Lesker|YSZ]] (Yttrium stabilized zirconia)<br/>
+[[/Sputter deposition of metals and alloys|YSZ]] (Yttrium stabilized zirconia)<br/>
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