Specific Process Knowledge/Thin film deposition: Difference between revisions
→Choose material to deposit: added new intermediate page on sputter deposition of metals and alloys |
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[[/Deposition of Aluminium|Aluminium]] <br/> | [[/Deposition of Aluminium|Aluminium]] <br/> | ||
[[/Deposition of Chromium|Chromium]]<br/> | [[/Deposition of Chromium|Chromium]]<br/> | ||
[[/ | [[/Sputter deposition of metals and alloys|Cobalt]]<br/> | ||
[[/Deposition of Copper|Copper]]<br/> | [[/Deposition of Copper|Copper]]<br/> | ||
[[/Deposition of Gold|Gold]]<br/> | [[/Deposition of Gold|Gold]]<br/> | ||
[[/ | [[/Sputter deposition of metals and alloys|Iron]]<br/> | ||
[[/ | [[/Sputter deposition of metals and alloys|Magnesium]]<br/> | ||
[[/Deposition of Molybdenum|Molybdenum]]<br/> | [[/Deposition of Molybdenum|Molybdenum]]<br/> | ||
[[/Deposition of Nickel|Nickel]]<br/> | [[/Deposition of Nickel|Nickel]]<br/> |
Revision as of 10:04, 29 July 2020
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Choose material to deposit
Semiconductors | Oxides | Nitrides | Metals | Alloys | Transparent conductive oxides | Polymers |
Aluminium Oxide (Al2O3)
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Silicon Nitride - and oxynitride
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Aluminium
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AlCu And an electroceramic: YSZ (Yttrium stabilized zirconia) |
ITO (Tin doped Indium Oxide) |
SU-8 |
Choose deposition equipment
PVD | LPCVD | PECVD | ALD | Coaters | Others
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See the Lithography/Coaters page for coating polymers |
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