Specific Process Knowledge/Thin film deposition: Difference between revisions
| Line 23: | Line 23: | ||
[[/Deposition of Titanium Oxide|Titanium Oxide (TiO<sub>2</sub>)]]<br/> | [[/Deposition of Titanium Oxide|Titanium Oxide (TiO<sub>2</sub>)]]<br/> | ||
[[/Lesker|Tantalum Oxide (Ta<sub>2</sub>O<sub>5</sub>)]]<br/> | [[/Lesker|Tantalum Oxide (Ta<sub>2</sub>O<sub>5</sub>)]]<br/> | ||
[[/Deposition of ZnO|Zinc Oxide (ZnO)]]<br/> | |||
|style="background: #DCDCDC"| | |style="background: #DCDCDC"| | ||
[[/Deposition of Silicon|Silicon]] <br/> | [[/Deposition of Silicon|Silicon]] <br/> | ||
[[/Deposition of Germanium|Germanium]] <br/> | [[/Deposition of Germanium|Germanium]] <br/> | ||
|style="background: LightGray"| | |style="background: LightGray"| | ||
Revision as of 09:48, 29 April 2020
Feedback to this page: click here
Choose material to deposit
| Oxides | Semicondutors | Metals | Nitrides | Alloys | Transparent conductive oxides | Polymers |
|
Aluminium Oxide (Al2O3) |
|
Aluminium
|
Silicon Nitride - and oxynitride |
AlCu And an electroceramic: YSZ (Yttrium stabilized zirconia) |
ITO (Tin doped Indium Oxide) |
SU-8 |
Choose deposition equipment
| PVD | LPCVD | PECVD | ALD | Coaters | Others
|
|
|
|
|
See the Lithography/Coaters page for coating polymers |
|