Specific Process Knowledge/Thin film deposition: Difference between revisions
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[[/Deposition of Titanium Oxide|Titanium Oxide (TiO<sub>2</sub>)]]<br/> | [[/Deposition of Titanium Oxide|Titanium Oxide (TiO<sub>2</sub>)]]<br/> | ||
[[/Lesker|Tantalum Oxide (Ta<sub>2</sub>O<sub>5</sub>)]]<br/> | [[/Lesker|Tantalum Oxide (Ta<sub>2</sub>O<sub>5</sub>)]]<br/> | ||
[[/Deposition of ZnO|Zinc Oxide (ZnO)]]<br/> | |||
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[[/Deposition of Silicon|Silicon]] <br/> | [[/Deposition of Silicon|Silicon]] <br/> | ||
[[/Deposition of Germanium|Germanium]] <br/> | [[/Deposition of Germanium|Germanium]] <br/> | ||
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Revision as of 10:48, 29 April 2020
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Choose material to deposit
| Oxides | Semicondutors | Metals | Nitrides | Alloys | Transparent conductive oxides | Polymers |
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Aluminium Oxide (Al2O3) |
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Aluminium
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Silicon Nitride - and oxynitride |
AlCu And an electroceramic: YSZ (Yttrium stabilized zirconia) |
ITO (Tin doped Indium Oxide) |
SU-8 |
Choose deposition equipment
| PVD | LPCVD | PECVD | ALD | Coaters | Others
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See the Lithography/Coaters page for coating polymers |
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