Specific Process Knowledge/Thin film deposition/Deposition of Aluminium: Difference between revisions
m →Comparison of Al deposition options: added ref to cross contamination sheets |
m →Comparison of Al deposition options: added link |
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|Depending on [[/Sputter rates for Al|process parameters]], up to ~2.5 Å/s | |Depending on [[/Sputter rates for Al|process parameters]], up to ~2.5 Å/s | ||
|Depending on process parameters at least up to 0.5 Å/s | |Depending on process parameters at least up to 0.5 Å/s | ||
|Depending on process parameters at least up to 1.3 Å/s | |Depending on process parameters at least up to 1.3 Å/s. See conditions [[Specific_Process_Knowledge/Thin_film_deposition/Cluster-based_multi-chamber_high_vacuum_sputtering_deposition_system#Standard_recipe_performance|here]] | ||
|~1.5 Å/s to 2 Å/s | |~1.5 Å/s to 2 Å/s | ||
|0.5, 1, or 2 Å/s | |0.5, 1, or 2 Å/s | ||