Specific Process Knowledge/Thin film deposition: Difference between revisions

Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3) - Cluster-based multi-chamber high vacuum sputtering deposition system
Lesker - Sputter tool
Wordentec - E-beam evaporator, sputter and thermal evaporator
Thermal evaporator
E Beam Evaporator (Temescal)
Physimeca - E-beam evaporator
IBE/IBSD Ionfab 300 - Sputter deposition of high quality optical layers and milling/etching
Sputter coater 03 - Gold sputtering system
Sputter coater 04 - Gold sputtering system

Furnace LPCVD Nitride (4" and 6") - Deposition of silicon nitride
Furnace LPCVD Polysilicon (4" and 6") Deposition of polysilicon
Furnace LPCVD TEOS (4") - Deposition of silicon oxide

PECVD - Plasma Enhanced Chemical Vapor deposition
Black Magic PECVD - Black Magic PECVD (Carbon)
Seki Diamond CVD - Microwave Plasma CVD for diamond Growth

ALD1 - Atomic Layer Deposition (thermal)
ALD2 (PEALD) - Atomic Layer Deposition (thermal and plasma enhanced)

See the Lithography/Coaters page for coating polymers

MVD - Molecular Vapor Deposition
Electroplating-Ni - Electrochemical deposition of nickel
Electroplating-Cu - Electrochemical deposition of copper
MOCVD - Epitaxial growth - Ask the department of photonics if you are interested: Elizaveta Semenova or Kresten Yvind

@@ Line 9: / Line 9: @@
 | align="left" valign="top" style="background:#DCDCDC;"|''' Semicondutors'''
 | align="left" valign="top" style="background:LightGray"|''' Metals'''
-| align="left" valign="top" style="background:#DCDCDC;"|''' Alloys'''
+| align="left" valign="top" style="background:#DCDCDC;"|''' Nitrides'''
-| align="left" valign="top" style="background:LightGray"|''' Transparent conductive oxides'''
+| align="left" valign="top" style="background:LightGray"|''' Alloys'''
-| align="left" valign="top" style="background:#DCDCDC"|''' Polymers'''
+| align="left" valign="top" style="background:#DCDCDC;"|''' Transparent conductive oxides'''
+| align="left" valign="top" style="background:LightGray"|''' Polymers'''
 |-valign="top"
 |style="background: LightGray"|
-[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''and oxynitride'' <br/>
 [[/Deposition of Silicon Oxide|Silicon Oxide]]<br/>
 [[/Deposition of Titanium Oxide|Titania (TiO<sub>2</sub>, Titanium Oxide)]]<br/>
 [[/Deposition of Alumina|Alumina (Al<sub>2</sub>O<sub>3</sub>, Aluminium Oxide)]]<br/>
-[[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/>
 [[/Lesker|Tantalum (Ta<sub>2</sub>O<sub>5</sub>, Tantalum pentoxide)]]<br/>
 [[/Lesker|Chromia (Cr<sub>2</sub>O<sub>3</sub>, Chromium Oxide)]]<br/>
 [[/Deposition of Hafnium Oxide|Hafnium Oxide]]<br/>
-[[/Deposition of Titanium Nitride|Titanium Nitride]] - ''ceramic'' <br/>
 |style="background: #DCDCDC"|
 [[/Deposition of Silicon|Silicon]] <br/>
 [[/Deposition of Germanium|Germanium]] <br/>
 [[/Deposition of ZnO|Zinc Oxide (ZnO)]]<br/>
 |style="background: LightGray"|
 [[/Deposition of Aluminium|Aluminium]] <br/>
@@ Line 47: / Line 48: @@
 [[/Deposition of Tungsten|Tungsten]]<br/>
 [[/Deposition of Zinc|Zinc]]<br/>
 |style="background: #DCDCDC"|
+[[/Deposition of Silicon Nitride|Silicon Nitride]] - ''and oxynitride'' <br/>
+[[/Deposition of Titanium Nitride|Titanium Nitride]] - ''ceramic'' <br/>
+[[/Deposition of Aluminium Nitride| Aluminum Nitride (Al<sub>x</sub>N<sub>y</sub>)]]<br/>
+|style="background: LightGray"|
 [[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/>
 [[/Deposition of NiV|NiV]] alloy <br/>
@@ Line 58: / Line 67: @@
 [[/Deposition of NiFe|NiFe]]<br/>
 [[/Lesker|YSZ (Yttrium stabilized Zirconium)]]<br/>
-|style="background: LightGray"|
+|style="background: #DCDCDC"|
 [[/Lesker|ITO (Tin doped Indium Oxide)]]<br/>
 [[/Deposition of AZO |AZO (Aluminum doped Zinc Oxide)]]<br/>
-|style="background: #DCDCDC"|
+|style="background: LightGray"|
 [[Specific Process Knowledge/Lithography/SU-8|SU-8]]<br/>
 [[Specific Process Knowledge/Thin film deposition/MVD#Processing on the MVD| Antistiction coating]] <br/>