Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions

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Revision as of 12:00, 25 March 2020 view source Reet (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231 1,760 edits →Surface roughness optimization ← Older edit		Revision as of 12:00, 25 March 2020 view source Reet (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231 1,760 edits →LESKER Sputter Tool Newer edit →
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	It can be a problem to take wafers from the sputter system and into the other machines in the cleanroom since the sputter system is not very clean. In principle sputtering should therefore be the last step before you take your wafers out of the cleanroom. If you need to process your wafers further please contact the Thin Film group so they can help you.		It can be a problem to take wafers from the sputter system and into the other machines in the cleanroom since the sputter system is not very clean. In principle sputtering should therefore be the last step before you take your wafers out of the cleanroom. If you need to process your wafers further please contact the Thin Film group so they can help you.

	Lift-off of magnetic materials should never be done in the normal lift-off bath in Cleanroom D-3. It should always be done in the dedicated lift-off bath in the fumehood next to the sputter system.		Lift-off of magnetic materials should never be done in the normal lift-off bath in Cleanroom D-4. It should always be done in the dedicated lift-off bath in the fumehood next to the sputter system.