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Specific Process Knowledge/Thin film deposition/Lesker: Difference between revisions

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The purpose of the "Sputter-system (Lesker)" is to deposit magnetic metals and dielectrica on a single 4" or 6" wafer at a time.
The purpose of the "Sputter-system (Lesker)" is to deposit magnetic metals and dielectrica on a single 4" or 6" wafer at a time.


It can be a problem to take wafers from the sputter and into the other machines in the cleanroom, since it is not very clean. In principle the sputter should be the last step before you take your wafers out of the cleanroom. If you need to take process your wafers further please contact the Thin Film group so they can help you.
It can be a problem to take wafers from the sputter system and into the other machines in the cleanroom since the sputter system is not very clean. In principle sputtering should therefore be the last step before you take your wafers out of the cleanroom. If you need to process your wafers further please contact the Thin Film group so they can help you.


Lift-off of magnetic materials should never be done in the normal lift-off bath in RR4. It should always be done in the dedicated lift-off bath in the fumehood next to the sputter.
Lift-off of magnetic materials should never be done in the normal lift-off bath in Cleanroom D-2. It should always be done in the dedicated lift-off bath in the fumehood next to the sputter.




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