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Specific Process Knowledge/Lithography/Development/Developer TMAH UV-lithography processing: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,528 edits
Line 102: Line 102:


''Sequence names and process parameters (Sequence no. 2000-2999):''
''Sequence names and process parameters (Sequence no. 2000-2999):''
*'''DCH PEB 110C 60s'''
*'''(2001) DCH PEB 110C 60s'''
*'''DCH PEB 110C 120s'''
*'''(2002) DCH PEB 110C 120s'''
Process parameters: Bake at 110°C. 20s cool at 20°C.
Process parameters: Bake at 110°C. 20s cool at 20°C.


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