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Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Eves (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,346 edits
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!style="background:silver; color:black;" align="center" |MD PC1 Src5 Pulse DC<br> Downstream with reactive O<sub>2</sub>
!style="background:silver; color:black;" align="center" |MD PC1 Src5 Pulse DC<br> Downstream with reactive O<sub>2</sub>


|style="background:LightGrey; color:black" align="center"|<b>Cu</b>
|style="background:LightGrey; color:black" align="center"|<b>Al</b>


|style="background:WhiteSmoke; color:black" align="center"|3
|style="background:WhiteSmoke; color:black" align="center"|3
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