Specific Process Knowledge/Thin film deposition: Difference between revisions
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[[/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-System Metal-Oxide(PC1)]] - ''Cluster-based multi-chamber high vacuum sputtering deposition system'' | |||
<!-- *[[/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-System Metal-Nitride(PC3)]] - ''Cluster-based multi-chamber high vacuum sputtering deposition system'' --> | <!-- *[[/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-System Metal-Nitride(PC3)]] - ''Cluster-based multi-chamber high vacuum sputtering deposition system'' --> | ||
*[[/Lesker|Lesker]] - ''Sputter tool'' | *[[/Lesker|Lesker]] - ''Sputter tool'' | ||