Specific Process Knowledge/Thin film deposition: Difference between revisions
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*[[/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-System Metal-Oxide(PC1)]] - ''Cluster-based multi-chamber high vacuum sputtering deposition system'' | |||
*[[/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-System Metal-Nitride(PC3)]] - ''Cluster-based multi-chamber high vacuum sputtering deposition system'' | |||
*[[/Lesker|Lesker]] - ''Sputter tool'' | *[[/Lesker|Lesker]] - ''Sputter tool'' | ||
*[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator'' | *[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator'' |
Revision as of 11:03, 20 March 2020
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Choose material to deposit
Dielectrica | Semicondutors | Metals | Alloys | Transparent conductive oxides | Polymers |
Silicon Nitride - and oxynitride |
Aluminium |
TiW alloy (10%/90% by weight) |
ITO (Tin doped Indium Oxide) |
SU-8 |
Choose deposition equipment
PVD | LPCVD | PECVD | ALD | Coaters | Others
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See the Lithography/Coaters page for coating polymers |
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