Specific Process Knowledge/Lithography/UVExposure: Difference between revisions
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'''Feedback to this section''': '''[mailto:lithography@Nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_01 click here]''' | '''Feedback to this section''': '''[mailto:lithography@Nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_Maskless_01 click here]''' | ||
[[Image:Heidelberg_MLA100.jpg|300x300px|thumb|Aligner: Maskless 01 positioned in E- | [[Image:Heidelberg_MLA100.jpg|300x300px|thumb|Aligner: Maskless 01 positioned in E-5 (2017)]] | ||
The MLA 100 Maskless Aligner located in the E-4 cleanroom is a direct exposure lithography tool. | The MLA 100 Maskless Aligner located in the E-4 cleanroom is a direct exposure lithography tool installed in 2017. | ||
It is a UV LED exposure system, that exposes the patterns directly on photosensitive resists on chips, 2, 4, and 6 inch substrates, without prior fabrication of the mask. | It is a UV LED exposure system, that exposes the patterns directly on photosensitive resists on chips, 2, 4, and 6 inch substrates, without prior fabrication of the mask. | ||
The system offers top side alignment with high accuracy. | The system offers top side alignment with high accuracy. | ||