Specific Process Knowledge/Lithography/UVExposure: Difference between revisions
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[[Image:Heidelberg_MLA100.jpg|300x300px|thumb|Aligner: Maskless 01 positioned in E-4]] | [[Image:Heidelberg_MLA100.jpg|300x300px|thumb|Aligner: Maskless 01 positioned in E-4]] | ||
The MLA 100 Maskless Aligner located in the E- | The MLA 100 Maskless Aligner located in the E-4 cleanroom is a direct exposure lithography tool. | ||
It is a UV LED exposure system, that exposes the patterns directly on photosensitive resists on chips, 2, 4, and 6 inch substrates, without prior fabrication of the mask. | It is a UV LED exposure system, that exposes the patterns directly on photosensitive resists on chips, 2, 4, and 6 inch substrates, without prior fabrication of the mask. | ||
The system offers top side alignment with high accuracy. | The system offers top side alignment with high accuracy. | ||