Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope: Difference between revisions
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* The shorter cycle times (Process A has 11 seconds full cycle and Process D4 has 3.2 second full cycle) emphasize the need for the faster process parameter sampling rate. For instance, a dep cycle with one measurement point for the C<sub>4</sub>F<sub>8</sub> flow is no good. | * The shorter cycle times (Process A has 11 seconds full cycle and Process D4 has 3.2 second full cycle) emphasize the need for the faster process parameter sampling rate. For instance, a dep cycle with one measurement point for the C<sub>4</sub>F<sub>8</sub> flow is no good. | ||
* The oscillations in pressure now last the entire dep cycle - it never stabilizes. | * The oscillations in pressure now last the entire dep cycle - it never stabilizes. | ||
* Optimizing a recipe to arrive at a minimum reflected power, for both coil and platen, using the Pro software datalogging may be somewhat illusory as it | * Optimizing a recipe to arrive at a minimum reflected power, for both coil and platen, using the Pro software datalogging may be somewhat illusory as it only picks a fraction of the spikes occurring at every change of plasma conditions. | ||