Specific Process Knowledge/Etch/DRIE-Pegasus/picoscope

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Process optimization using the Picoscope

The original standard recipes on Pegasus 1 differ in many ways. The second step of one of them is listed below:

Process A Step 2 parameters
Parameter	Etch	Dep
Gas flow (sccm)	SF6 350 (1.5 s), 550	C4F8 200
Cycle time (secs)	7.0	4.0
Pressure (mtorr)	25 (1.5 s), 150	25
Coil power (W)	2800	2000
Platen power (W)	140 (1.5) 45	0
Common	Temperature 20 degs

When running any recipe on the SPTS Pro software, a set of process parameters are recorded (defined in the logging recipe that can be modified like any other recipe) as the process runs. This data can be accessed later by looking up the datalog. During the process itself, one can also activate the 'Trace' to monitor the process parameters in real time.

• 4 cycles of Process A <span id=
• 
  Left: Recorded with the SPTS software
• 
  Right: Recorded with the Picoscope

• 4 cycles of Process D4
• 
  Left: Recorded with the SPTS software
• 
  Right: Recorded with the Picoscope

4 cycles of the recipe PrD4 recorded with the Picoscope

4 cycles of the recipe PrD4 recorded with the SPTS software

4 cycles of the recipe Prcocess A recorded with the Picoscope

4 cycles of the recipe PrD4 recorded with the SPTS software