Specific Process Knowledge/Thin film deposition: Difference between revisions

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*[[/thermalevaporator|Thermal evaporator]] - ''Thermal evaporator''
*[[/thermalevaporator|Thermal evaporator]] - ''Thermal evaporator''
*[[/Temescal|E Beam Evaporator (Temescal)]]
*[[/Temescal|E Beam Evaporator (Temescal)]]
*[[/Physimeca|Physimeca]] - ''E-beam evaporator (III-V lab)''
*[[/Physimeca|Physimeca]] - ''E-beam evaporator''
*[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] - ''Sputter deposition of high quality optical layers and milling/etching''
*[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] - ''Sputter deposition of high quality optical layers and milling/etching''
*[[/Sputter coater#Sputter_coater_03_(Cressington)|Sputter coater 03]] - ''Gold sputtering system''
*[[/Sputter coater#Sputter_coater_03_(Cressington)|Sputter coater 03]] - ''Gold sputtering system''

Revision as of 11:11, 17 March 2020

3rd Level - Material/Method

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Choose material to deposit

Dielectrica Semicondutors Metals Alloys Transparent conductive oxides Polymers

Silicon Nitride - and oxynitride
Silicon Oxide
Titania (TiO2, Titanium Oxide)
Alumina (Al2O3, Aluminium Oxide)
Aluminum Nitride (AlxNy)
Tantalum (Ta2O5, Tantalum pentoxide)
Cromia (Cr2O3, Chromium Oxide)
Hafnium Oxide
Titanium Nitride - ceramic

Silicon
Germanium
Zinc Oxide (ZnO)

Aluminium
Chromium
Cobalt
Copper
Gold
Iron
Magnesium
Molybdenum
Nickel
Niobium
Palladium
Platinum
Ruthenium
Silver
Tantalum
Tin
Titanium
Tungsten
Zinc

TiW alloy (10%/90% by weight)
NiV alloy
AlCu
CoFe
CuTi
FeMn
MnIr
NiCo
NiFe
YSZ (Yttrium stabilized Zirconium)

ITO (Tin doped Indium Oxide)
AZO (Aluminum doped Zinc Oxide)

SU-8
Antistiction coating
Topas
PMMA

Choose deposition equipment

PVD LPCVD PECVD ALD Coaters Others


  • ALD1 - Atomic Layer Deposition (thermal)
  • ALD2 (PEALD) - Atomic Layer Deposition (thermal and plasma enhanced)

See the Lithography/Coaters page for coating polymers