Specific Process Knowledge/Back-end processing/Hot Embosser

THIS PAGE IS UNDER CONSTRUCTION

Feedback to this page: click here

Name of equipment

Write a short description of the equipment(s).

File:Cluster1.jpg

Image(s) of the equipment(s)

The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

Hot Embosser in LabManager

Process information

Link to process pages - e.g. one page for each material

Example:

Equipment performance and process related parameters

Equipment		Equipment 1
Purpose		Hot Embossing Chip Bonding
Performance	Press Plates Temperature	Upper Plate max temperature 285 degrees Celsius Lower Plate max temperature 285 degrees Celsius
	Press Plates Pressure	Max pressure allowed 300 kN
Process parameter range	Temperature	0-285 degrees Celsius
	Pressure	1.5-300 kN
Substrates	Batch size	# small samples # 50 mm wafers # 100 mm wafers # 150 mm wafers # 200 mm wafers # odd sized samples, contact for the machine responsible personel
	Allowed materials	PMMA TOPAS 5013-L10 TOPAS 8007 PC PP PCL SU8 Graphene Metals (Al,Ni....) For other materials contact for machine responsible personel