Specific Process Knowledge/Back-end processing/Hot Embosser: Difference between revisions

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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/... click here]'''
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Hot_Embosser click here]'''
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Revision as of 15:02, 25 February 2020

THIS PAGE IS UNDER CONSTRUCTION

Feedback to this page: click here

Name of equipment

Write a short description of the equipment(s).

File:Cluster1.jpg
Image(s) of the equipment(s)


The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:

Hot Embosser in LabManager

Process information

Link to process pages - e.g. one page for each material

Example:

Equipment performance and process related parameters

Equipment Equipment 1
Purpose
  • Purpose 1
  • Purpose 2
Performance Response 1
  • Performance range 1
  • Performance range 2
Response 2
  • Performance range
Process parameter range Parameter 1
  • Range
Parameter 2
  • Range
Substrates Batch size
  • # small samples
  • # 50 mm wafers
  • # 100 mm wafers
  • # 150 mm wafers
Allowed materials
  • Allowed material 1
  • Allowed material 2


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