Specific Process Knowledge/Thin film deposition/Furnace LPCVD Nitride: Difference between revisions
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== Rules for storage and RCA cleaning of wafers to the B stack furnaces == | == Rules for storage and RCA cleaning of wafers to the B stack furnaces == | ||
*[[ | *[[Specific_Process_Knowledge/Thermal_Process/Storage_and_cleaning_of_wafer_to_the_A,_B,_C_and_E_stack_furnaces|Storage and cleaning of wafer to the B stack furnaces]] | ||
==Equipment performance and process related parameters== | ==Equipment performance and process related parameters== | ||