Specific Process Knowledge/Etch/Wet III-V Etches: Difference between revisions
Appearance
No edit summary |
|||
| Line 21: | Line 21: | ||
There should be two bottles in the fumehood one for HCl used to etch InP substrates and one for citric acid: H2O2 or H2SO4 (10%):H2O2 used to etch GaAs substrates. | There should be two bottles in the fumehood one for HCl used to etch InP substrates and one for citric acid: H2O2 or H2SO4 (10%):H2O2 used to etch GaAs substrates. | ||
Once the bottles are full, you should bring them in | Once the bottles are full, you should bring them in the basement of building 346 and have a new one in CR. '''For the GaAs waste you should use empty H2O2 bottles (since they should have a special lid that avoid overpressure)''', while for InP waste we can use an empty and clean developer bottle. | ||
==HCl:H3PO4 etch== | ==HCl:H3PO4 etch== | ||