Specific Process Knowledge/Thin film deposition/Deposition of Silicon: Difference between revisions
Appearance
No edit summary |
|||
| Line 15: | Line 15: | ||
==Deposition of Silicon using sputter deposition technique== | ==Deposition of Silicon using sputter deposition technique== | ||
At Nanolab you can also deposit silicon the using Wordentec, the Lesker Sputter | At Nanolab you can also deposit silicon the using Wordentec, the Lesker Sputter systems or the IBE Ionfab300 sputter systems. One of the advantages here is that you can deposit on any material you like. | ||
* [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBSD of Si|Si deposition in IBE⁄IBSD Ionfab300]] | * [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/IBSD of Si|Si deposition in IBE⁄IBSD Ionfab300]] | ||
* [[Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec|Si sputter deposition in the Wordentec.]] | |||
==Deposition of Silicon using PECVD== | ==Deposition of Silicon using PECVD== | ||