Specific Process Knowledge/Lithography/LiftOff: Difference between revisions
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*'''4'''. The masking material is dissolved, thus lifting part of the deposited material. | *'''4'''. The masking material is dissolved, thus lifting part of the deposited material. | ||
*'''5'''. The remaining material forms the desired pattern on the substrate. | *'''5'''. The remaining material forms the desired pattern on the substrate. | ||
'''Please note:''' | |||
At the DTU Nanolab cleanroom facility, it is only allowed to do lift-off in | |||
*<b>[[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off]]</b> | |||
*<b>[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=370 Fume hood 03: Solvents]</b> | |||
<br clear="all" /> | <br clear="all" /> | ||