Specific Process Knowledge/Lithography/LiftOff: Difference between revisions
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=Lift-off Comparison Table= | |||
{| border="2" cellspacing="0" cellpadding="2" | |||
!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | |||
|style="background:WhiteSmoke; color:black" align="center"|<b>[[Specific Process Knowledge/Lithography/LiftOff#Lift-off_wet_bench_07|Lift-off]]</b> | |||
|style="background:WhiteSmoke; color:black" align="center"|<b>[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=370 Fume hood 03: Solvents]</b> | |||
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!style="background:silver; color:black;" align="center"|Purpose | |||
|style="background:LightGrey; color:black"| | |||
|style="background:WhiteSmoke; color:black"| | |||
Lift-off of e.g. metal using | |||
* UV resists | |||
* e-beam resists | |||
|style="background:WhiteSmoke; color:black"| | |||
General solvent work, including lift-off. | |||
DO NOT use these fume hoods for lift-off: | |||
* Fume hood 04: Solvents | |||
* Fume hood 09: UV development or | |||
* Fume hood 10: e-beam development | |||
|- | |||
!style="background:silver; color:black;" align="center"|Bath chemical | |||
|style="background:LightGrey; color:black"| | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
NMP (Remover 1165) / Rinse in IPA | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
User defined | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters | |||
|style="background:LightGrey; color:black"|Process temperature | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
Heating of the bath is possible. | |||
The heating has been limited to 60°C | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
Heating is possible using portable hotplate or portable ultrasonic bath | |||
|- | |||
|style="background:LightGrey; color:black"|Ultrasonic agitation | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
Continuous or pulsed | |||
The power may be varied | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
Ultrasonic agitation is possible using portable ultrasonic bath | |||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | |||
|style="background:LightGrey; color:black"|Substrate size | |||
|style="background:WhiteSmoke; color:black"| | |||
* 100 mm wafers | |||
* 150 mm wafers | |||
|style="background:WhiteSmoke; color:black"| | |||
* In principle any, typically chips | |||
|- | |||
| style="background:LightGrey; color:black"|Allowed materials | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
Silicon or glass wafers | |||
Film or patterning of all but Type IV (Pb, Te) | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
Any cleanroom material | |||
|- | |||
|style="background:LightGrey; color:black"|Batch | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
1 - 25 | |||
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1 | |||
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|} | |||
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=Lift-off process= | =Lift-off process= | ||
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=Lift-off wet bench 07= | =Lift-off at Nanolab= | ||
==Lift-off wet bench 07== | |||
[[Image:Lift_off.jpg|300x300px|thumb|Lift-off wet bench in D-3]] | [[Image:Lift_off.jpg|300x300px|thumb|Lift-off wet bench in D-3]] | ||
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== Process information == | === Process information === | ||
Lift-off is used for lift-off using resists that are soluble in NMP (''N''-Methyl-Pyrrolidone), supplied in the cleanroom as "Remover 1165". Both AZ 5214E and AZ nLOF are soluble in NMP. | Lift-off is used for lift-off using resists that are soluble in NMP (''N''-Methyl-Pyrrolidone), supplied in the cleanroom as "Remover 1165". Both AZ 5214E and AZ nLOF are soluble in NMP. | ||