Specific Process Knowledge/Thermal Process: Difference between revisions
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*[[/Furnace: Multipurpose annealing |Furnace: Multipurpose annealing ]] - ''For annealing, oxidation and resist pyrolysis'' | *[[/Furnace: Multipurpose annealing |Furnace: Multipurpose annealing ]] - ''For annealing, oxidation and resist pyrolysis'' | ||
*[[/Jipelec RTP|Jipelec RTP]] - ''For rapid thermal annealing of III-V materials and Si based materials'' | *[[/Jipelec RTP|Jipelec RTP]] - ''For rapid thermal annealing of III-V materials and Si based materials'' | ||
*[[/BCB Curing Oven|BCB Curing oven]] - ''For resist curing and metal alloying'' | *[[/BCB Curing Oven|BCB Curing oven]] - ''For resist curing and metal alloying''layers'' | ||
== Decommissioned equipment == | == Decommissioned equipment == | ||
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*[[/Furnace APOX|APOX furnace]] - ''For growing of very thick oxide layers'' </span> | *[[/Furnace APOX|APOX furnace]] - ''For growing of very thick oxide layers'' </span> | ||
*[[/D4 III-V Oven|III-V Oven (D4)]] - ''For oxidation of Al<sub>x</sub>GaAs layers.'' </span> | *[[/D4 III-V Oven|III-V Oven (D4)]] - ''For oxidation of Al<sub>x</sub>GaAs layers.'' </span> | ||
*[[/Resist Pyrolysis Furnace|Resist Pyrolysis furnace]] - ''For pyrolysis of different resist | |||