Specific Process Knowledge/Lithography/Development: Difference between revisions
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!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment | ||
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer-6inch|Developer: 6inch]]</b> | |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer-6inch|Developer: 6inch]]</b> | ||
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#SU8-Developer|SU8-Developer]]</b> | |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#SU8-Developer|SU8-Developer]]</b> | ||
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|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual|Developer: TMAH Manual]]</b> | |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual|Developer: TMAH Manual]]</b> | ||
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]</b> | |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]</b> | ||
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/DUVStepperLithography#Developer_TMAH_Stepper|Developer: TMAH Stepper]]</b> | |||
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!style="background:silver; color:black" align="center" width="60"|Purpose | !style="background:silver; color:black" align="center" width="60"|Purpose | ||
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Development of | Development of | ||
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*AZ 5214E | *AZ 5214E | ||
*AZ 4562 | *AZ 4562 | ||
*DUV resists | |||
Post-exposure baking | |||
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Development of | |||
*DUV resists | *DUV resists | ||
Post-exposure baking | Post-exposure baking | ||
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!style="background:silver; color:black" align="center" width="60"|Developer | !style="background:silver; color:black" align="center" width="60"|Developer | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
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AZ 351B diluted 1:5 in water | AZ 351B diluted 1:5 in water | ||
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AR600-546 | AR600-546 | ||
( | |style="background:WhiteSmoke; color:black" align="center"| | ||
AZ 726 MIF | |||
(2.38% TMAH in water) | |||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
AZ 726 MIF | AZ 726 MIF | ||
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Submersion | Submersion | ||
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Spray/Puddle | |||
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Spray/Puddle | Spray/Puddle | ||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
Puddle | |||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
Puddle | Puddle | ||
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|style="background:LightGrey; color:black"|Handling | |style="background:LightGrey; color:black"|Handling | ||
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Cassette | Cassette | ||
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|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
Edge handling chuck or chip "basket" | Edge handling chuck or chip "basket" | ||
|style="background:WhiteSmoke; color:black" align="center"| | |||
Vacuum chuck | |||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
Vacuum chuck | Vacuum chuck | ||
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22°C | 22°C | ||
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Room temperature | |||
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Room temperature | Room temperature | ||
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|style="background:LightGrey; color:black"|Agitation | |style="background:LightGrey; color:black"|Agitation | ||
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Circulation and mechanical | Circulation and mechanical | ||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
Magnetic stirrer | Magnetic stirrer | ||
|style="background:WhiteSmoke; color:black" align="center"| | |||
Rotation | |||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
Rotation | Rotation | ||
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DI water | DI water | ||
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IPA | |||
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IPA | IPA | ||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
DI water | |||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
DI water | DI water | ||
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!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
|style="background:LightGrey; color:black"|Substrate size | |style="background:LightGrey; color:black"|Substrate size | ||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
* 100 mm wafers | * 100 mm wafers | ||
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* 100 mm wafers | * 100 mm wafers | ||
* 150 mm wafers | * 150 mm wafers | ||
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* 100 mm wafers | |||
* 150 mm wafers | |||
* 200 mm wafers (may require tool change) | |||
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|style="background:LightGrey; color:black"|Allowed materials | |style="background:LightGrey; color:black"|Allowed materials | ||
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Silicon, glass, and polymer substrates | Silicon, glass, and polymer substrates | ||
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Silicon and glass substrates | Silicon and glass substrates | ||
Film or pattern of all but Type IV | |||
|style="background:WhiteSmoke; color:black" align="center"| | |||
Silicon, III-V, and glass substrates | |||
Film or pattern of all but Type IV | Film or pattern of all but Type IV | ||
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|style="background:LightGrey; color:black"|Batch | |style="background:LightGrey; color:black"|Batch | ||
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1-25 | 1-25 | ||
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|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
1-25 | 1-25 | ||
|style="background:WhiteSmoke; color:black" align="center"| | |||
1-25 | |||
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