Specific Process Knowledge/Pattern Design: Difference between revisions
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* For '''laser cutting''' the layout file has to be saved as a DXF file that is uploaded to the equipment computer. | * For '''laser cutting''' the layout file has to be saved as a DXF file that is uploaded to the equipment computer. | ||
* For '''UV-lithography''' it is | * For '''UV-lithography''' it is necessary to have a physical mask produced based on a layout file. The file format has to be CIF or GDS. For more details see below [[Specific_Process_Knowledge/Pattern_Design#Mask Fabrication for UV-lithography|Mask Fabrication for UV-lithography]]. | ||
* For '''DUV-lithography''' and DUV-lithography it is necescary to have physical masks (reticles) produced based on the layout file. The file format has to be GDS. For more details concerning the design of reticles see [[Specific_Process_Knowledge/Lithography/DUVStepperLithography#Process_information|Design of Reticles]]. | * For '''DUV-lithography''' and DUV-lithography it is necescary to have physical masks (reticles) produced based on the layout file. The file format has to be GDS. For more details concerning the design of reticles see [[Specific_Process_Knowledge/Lithography/DUVStepperLithography#Process_information|Design of Reticles]]. | ||