Specific Process Knowledge/Lithography/Development: Difference between revisions
Appearance
| Line 9: | Line 9: | ||
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer-6inch|Developer: 6inch]]</b> | |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer-6inch|Developer: 6inch]]</b> | ||
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#SU8-Developer|SU8-Developer]]</b> | |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#SU8-Developer|SU8-Developer]]</b> | ||
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual|Developer: TMAH Manual]]</b> | |||
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual|Developer: TMAH Manual]]</b> | |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer:_TMAH_Manual|Developer: TMAH Manual]]</b> | ||
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]</b> | |style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/Development#Developer_TMAH_UV-lithography|Developer: TMAH UV-lithography]]</b> | ||
| Line 26: | Line 27: | ||
Development of | Development of | ||
*SU-8 | *SU-8 | ||
|style="background:WhiteSmoke; color:black" align="center"| | |||
Development of | |||
*CSAR | |||
*Zep520A | |||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
Development of | Development of | ||
| Line 57: | Line 62: | ||
(PGMEA) | (PGMEA) | ||
|style="background:WhiteSmoke; color:black" align="center"| | |||
N-50 | |||
AR600-546 | |||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
AZ 726 MIF | AZ 726 MIF | ||
| Line 75: | Line 83: | ||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
Submersion | Submersion | ||
|style="background:WhiteSmoke; color:black" align="center"| | |||
Spray/Puddle | |||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
Spray/Puddle | Spray/Puddle | ||
| Line 87: | Line 97: | ||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
Single wafer holder | Single wafer holder | ||
|style="background:WhiteSmoke; color:black" align="center"| | |||
Vacuum chuck for 2",4" and 6" (the same) or chip "basket" | |||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
Edge handling chuck or chip "basket" | Edge handling chuck or chip "basket" | ||
| Line 99: | Line 111: | ||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
22°C | 22°C | ||
|style="background:WhiteSmoke; color:black" align="center"| | |||
Room temperature | |||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
Room temperature | Room temperature | ||
| Line 113: | Line 127: | ||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
Magnetic stirrer | Magnetic stirrer | ||
|style="background:WhiteSmoke; color:black" align="center"| | |||
Rotation | |||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
Rotation | Rotation | ||
| Line 123: | Line 139: | ||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
DI water | DI water | ||
|style="background:WhiteSmoke; color:black" align="center"| | |||
IPA | |||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
IPA | IPA | ||
| Line 140: | Line 158: | ||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
* 100 mm wafers | * 100 mm wafers | ||
|style="background:WhiteSmoke; color:black" align="center"| | |||
* Chips (5mm to 2") | |||
* 50 mm wafers | |||
* 100 mm wafers | |||
* 150 mm wafers | |||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
* Chips (5mm to 2") | * Chips (5mm to 2") | ||
| Line 162: | Line 185: | ||
Film or pattern of all but Type IV | Film or pattern of all but Type IV | ||
|style="background:WhiteSmoke; color:black" align="center"| | |||
All cleanroom approved materials | |||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
All cleanroom approved materials | All cleanroom approved materials | ||
| Line 178: | Line 205: | ||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
1-6 | 1-6 | ||
|style="background:WhiteSmoke; color:black" align="center"| | |||
1 | |||
|style="background:WhiteSmoke; color:black" align="center"| | |style="background:WhiteSmoke; color:black" align="center"| | ||
1 | 1 | ||