Specific Process Knowledge/Lithography/Development: Difference between revisions

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 Development of
-*AZ nLOF
+*CSAR
-*AZ MiR 701
+*ZEP520A
-*AZ 5214E
-*AZ 4562
-*DUV resists
 |-
 !style="background:silver; color:black;" align="center" width="60"|Developer
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-AZ 726 MIF
+AR 600-546 (546(
+N-50
-(2.38% TMAH in water)
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Method
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 |style="background:LightGrey; color:black"|Handling
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-Edge handling chuck or chip "basket"
+Vacuum chuck for 2",4" or 6" wafers and chip "basket"
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 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
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 |style="background:LightGrey; color:black"|Agitation
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-none
+Yes 15rpm back and forth
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 |style="background:LightGrey; color:black"|Rinse
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-DI water
+IPA - Isopropanol
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
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 * Chips (6-60 mm)
+* 50 mm wafers
 * 100 mm wafers
 * 150 mm wafers