Specific Process Knowledge/Thin film deposition: Difference between revisions
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[[/Deposition of Titanium|Titanium]]<br/> | [[/Deposition of Titanium|Titanium]]<br/> | ||
[[/Deposition of Tungsten|Tungsten]]<br/> | [[/Deposition of Tungsten|Tungsten]]<br/> | ||
[[/Deposition of Zinc|Zinc]]<br/> | |||
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[[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/> | [[/Deposition of TiW|TiW]] alloy (10%/90% by weight) <br/> |
Revision as of 15:04, 14 September 2018
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Choose material to deposit
Dielectrica | Semicondutors | Metals | Alloys | Transparent conductive oxides | Polymers |
Silicon Nitride - and oxynitride |
Aluminium |
TiW alloy (10%/90% by weight) |
ITO (Tin doped Indium Oxide) |
SU-8 |
Choose deposition equipment
PVD | LPCVD | PECVD | ALD | Coaters | Others
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See the Lithography/Coaters page for coating polymers |
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