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Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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'''SPTS process notation'''
'''SPTS process notation'''


Describing a process recipe on the Pegasus may sometimes be difficult because of the great flexibility of the instrument. A compact and precise notation is therefore required for the recipes. Click [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Notation|here]] to find a short description of the official SPTS notation.
Describing a process recipe on the Pegasus may sometimes be difficult because of the great flexibility of the instrument. A compact and precise notation is therefore required for the recipes. Click [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Notation|'''HERE''']] to find a short description of the official SPTS notation.
 
'''[[Specific Process Knowledge/Etch/DRIE-Pegasus/StandardRecipes|Standard recipes]]'''
 
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/processA|Process A (Large trench): 80 µm wide trench etched down to a depth of 150 µm]]
 
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/processB|Process B (Via etch): 30 µm diameter via etched down to a depth of 100 µm]]
 
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/processC|Process C (Nano etch): 50-300 nm posts]]
 
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/processD|Process D (Micro stamp) ''Please note that this process has changed'' ]]
 
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/SOIetch|SOI etch]]


'''Hardware changes'''
'''Hardware changes'''
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