Specific Process Knowledge/Thin film deposition: Difference between revisions
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*[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator'' | *[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator'' | ||
*[[/thermalevaporator|Thermal evaporator]] - ''Thermal evaporator'' | *[[/thermalevaporator|Thermal evaporator]] - ''Thermal evaporator'' | ||
*[[/Temescal|E Beam Evaporator (Temescal)]] | |||
*[[/Physimeca|Physimeca]] - ''E-beam evaporator (III-V lab)'' | *[[/Physimeca|Physimeca]] - ''E-beam evaporator (III-V lab)'' | ||
*[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] - ''Sputter deposition of high quality optical layers and milling/etching'' | *[[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE/IBSD Ionfab 300]] - ''Sputter deposition of high quality optical layers and milling/etching'' |
Revision as of 10:02, 17 May 2018
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Choose material to deposit
Dielectrica | Semicondutors | Metals | Alloys | Transparent conductive oxides | Polymers |
Silicon Nitride - and oxynitride |
Aluminium |
TiW alloy (10%/90% by weight) |
ITO (Tin doped Indium Oxide) |
SU-8 |
Choose deposition equipment
PVD | LPCVD | PECVD | ALD | Coaters | Others
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See the Lithography/Coaters page for coating polymers |
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