Specific Process Knowledge/Thin film deposition/Electroplating-Ni: Difference between revisions
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== Technotrans microform.200 == | == Technotrans microform.200 == | ||
[[image: | [[image:Electroplater-D3.jpg|200x200px|right|thumb|Electroplating-Ni positioned in cleanroom D-3]] | ||
The Technotrans microform.200 (Electroplating-Ni in LabManager) is a machine capable of depositing nickel electrochemically. This is done by lowering the sample into an electrolyte containing nickel ions and then apply a voltage across the sample and the anode. The anode is a titanium basket filled with nickel pellets. The cathode is the sample to be coated with nickel. | The Technotrans microform.200 (Electroplating-Ni in LabManager) is a machine capable of depositing nickel electrochemically. This is done by lowering the sample into an electrolyte containing nickel ions and then apply a voltage across the sample and the anode. The anode is a titanium basket filled with nickel pellets. The cathode is the sample to be coated with nickel. | ||