Specific Process Knowledge/Etch/Wet Gold Etch: Difference between revisions

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Ething of Gold can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done with IBE by sputtering with Ar ions.

Etching of Gold

Wet Gold Etch can be done in Fumehood 1 or 2 in cleanroom D-3

Wet etching of gold is done making your own set up using a beaker in a fumehood. You can see the APV here.

We have two different solutions:

Iodine etch: KI:I₂:H₂O - 100g:25g:500ml - standard at Danchip. Can be used with AZ resist as mask.
Aqua Regia (Kongevand): HNO₃:HCl - 1:3 - A very strong acid which will etch most metals and is therefore used when you wish to remove all the gold from your wafer. You must be very careful when working with Aqua Regia (Kongevand). It can generate nitrogen oxide gases which are very toxic!!

Comparing the two solutions

	Iodine based gold etch	Aqua Regia (kongevand)	Dilute Aqua Regia (fortyndet kongevand)
General description	Etch of gold with or without photoresist mask.	Etch of gold (as stripper).	Etch of gold.
Link to safety APV	See APV here.	See APV here	See APV here
Chemical solution	KI:I₂:H₂O (100g:25g:500ml)	HCl:HNO₃ (3:1)	HCl:HNO₃:H₂O (3:1:2)
Process temperature	20°C	20°C	20-30°C
Possible masking materials	Photoresist (1.5 µm AZ5214E)	Unmasked - used as a stripper	Difficult to mask. Mainly used as a stripper.
Etch rate	~100 nm/min	~(??) nm/min - fast etch	~680 nm/min at 30°C
Batch size	1-5 4" wafers at a time	1-5 4" wafers at a time	1-5 4" wafers at a time
Size of substrate	Any size and number that can go inside the beaker in use	Any size and number that can go inside the beaker in use	Any size and number that can go inside the beaker in use
Allowed materials	No restrictions when used in beaker. Make a note on the beaker of which materials have been processed.	No restrictions when used in beaker. Make a note on the beaker of which materials have been processed.	No restrictions when used in beaker. Make a note on the beaker of which materials have been processed.

@@ Line 26: / Line 26: @@
 !
 ! Iodine based gold etch
-! Aqua Regia (Kongevand)
+! Aqua Regia (kongevand)
+! Dilute Aqua Regia (fortyndet kongevand)
 |-
@@ Line 33: / Line 34: @@
 !General description
 |
-Etch of pure Gold with or without photoresist mask.
+Etch of gold with or without photoresist mask.
 |
-Etch of pure Gold (as stripper).
+Etch of gold (as stripper).
+|
+Etch of gold.
 |-
@@ Line 41: / Line 44: @@
 !Link to safety APV
 |[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 See APV here].
+|[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 See APV here]
 |[http://labmanager.dtu.dk/d4Show.php?id=4748&mach=368 See APV here]
 |-
@@ Line 49: / Line 53: @@
 |KI:I<sub>2</sub>:H<sub>2</sub>O   (100g:25g:500ml)
 |HCl:HNO<sub>3</sub>  (3:1)
+|HCl:HNO<sub>3</sub>:H<sub>2</sub>O  (3:1:2)
 |-
@@ Line 54: / Line 59: @@
 |-style="background:LightGrey; color:black"
 !Process temperature
-|20 <sup>o</sup>C
+|20°C
-|20 <sup>o</sup>C
+|20°C
+|20-30°C
 |-
@@ Line 67: / Line 73: @@
 |
 Unmasked - used as a stripper
+|
+Difficult to mask. Mainly used as a stripper.
 |-
@@ Line 76: / Line 84: @@
 |
 ~(??) nm/min - fast etch
+|
+~680 nm/min at 30°C
 |-
@@ Line 82: / Line 92: @@
 !Batch size
 |
--5  4" wafers at a time
+-5 4" wafers at a time
 |
--5 4" wafer at a time
+-5 4" wafers at a time
+|
+-5 4" wafers at a time
 |-
@@ Line 90: / Line 102: @@
 |-style="background:LightGrey; color:black"
 !Size of substrate
+|Any size and number that can go inside the beaker in use
 |Any size and number that can go inside the beaker in use
 |Any size and number that can go inside the beaker in use
@@ Line 101: / Line 114: @@
 |
 No restrictions when used in beaker.
+Make a note on the beaker of which materials have been processed.
+|
+No restrictions when used in beaker.
 Make a note on the beaker of which materials have been processed.
 |-
 |}