Specific Process Knowledge/Thin film deposition: Difference between revisions
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*[[/Alcatel|Alcatel]] - ''E-beam evaporator and sputter tool'' | *[[/Alcatel|Alcatel]] - <span style="color:Red"> (Will be decommissioned</span>) ''E-beam evaporator and sputter tool'' | ||
*[[/Lesker|Lesker]] - ''Sputter tool'' | *[[/Lesker|Lesker]] - ''Sputter tool'' | ||
*[[/Multisource_PVD|PVD co-sputter/evaporation]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and multiple wafer tool'' | *[[/Multisource_PVD|PVD co-sputter/evaporation]] - <span style="color:Red"> (Decommissioned</span>) ''E-beam evaporator and multiple wafer tool'' |
Revision as of 10:53, 2 March 2018
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Choose material to deposit
Dielectrica | Semicondutors | Metals | Alloys | Transparent conductive oxides | Polymers |
Silicon Nitride - and oxynitride |
Aluminium |
TiW alloy (10%/90% by weight) |
ITO (Tin doped Indium Oxide) |
SU-8 |
Choose deposition equipment
PVD | LPCVD | PECVD | ALD | Coaters | Others
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See the Lithography/Coaters page for coating polymers |
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