Specific Process Knowledge/Thin film deposition/thermalevaporator: Difference between revisions

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==Thermal evaporator- A system for deposition of metals==
==Thermal evaporator- A system for deposition of metals==
[[Image:IMG_2592_edit.jpg|300x300px|thumb| Positioned in cleanroom A-1.]]
[[Image:IMG_2592_edit.jpg|300x300px|thumb| Positioned in cleanroom A-1.]]
The main purpose for the thermal evaporator is to deposition of Al for removing charging of the restsit when doing EBL on isolerede substrate.
It is no only usable for Al deposition. The thermal evaporator have room for two boats and there by the possibility to make thinfilms of two different metals. At the moment not that many metals have been test and made a recipe for. Right now is is only Al and Ag that can be used. 


'''The user manual, APV, technical information and contact information can be found in LabManager:'''  
'''The user manual, APV, technical information and contact information can be found in LabManager:'''  

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Thermal evaporator- A system for deposition of metals

Positioned in cleanroom A-1.

The main purpose for the thermal evaporator is to deposition of Al for removing charging of the restsit when doing EBL on isolerede substrate.

It is no only usable for Al deposition. The thermal evaporator have room for two boats and there by the possibility to make thinfilms of two different metals. At the moment not that many metals have been test and made a recipe for. Right now is is only Al and Ag that can be used.


The user manual, APV, technical information and contact information can be found in LabManager:

Thermal Evaporator in LabManager


Process information

Materials for thermal evaporator evaporation


Equipment performance and process related parameters Alcatel

Purpose Deposition of metals and silicon
  • Thermal evaporation of metals
Performance Film thickness
  • 10Å - 1µm* (for some materials)
Deposition rate
  • 0.5 Å/s - 5 Å/s (material dependens)
Process parameter range Process Temperature
  • Approximately room temperature
Process pressure
  • Low than 4*10-6 mbar
Substrates Batch size
  • Up to 8" wafer
  • Or several smaller pieces
  • Deposition on one side of the substrate
Substrate material allowed
  • Silicon wafers
  • Quartz wafers
  • Pyrex wafers
Material allowed on the substrate
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • Metals

* For thicknesses above 200 nm permission is requested.