Jump to content

Specific Process Knowledge/Characterization/Probe station: Difference between revisions

← Older editNewer edit →
VisualWikitext
Rkch (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
284 edits
Rkch (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
284 edits
Line 9: Line 9:


During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.
==Quality Control - Recipe Parameters and Limits==
{| border="1" cellspacing="2" cellpadding="2" colspan="3"
|bgcolor="#98FB98" |'''Quality Control (QC) for the Thickness measurer'''
|-
|
The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year.
*[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach=198 The QC procedure]<br>
*[http://www.labmanager.danchip.dtu.dk/view_binary.php?fileId=2062 The newest QC data]<br>
|}


==Equipment performance and process related parameters==
==Equipment performance and process related parameters==
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Characterization/Probe_station"