Specific Process Knowledge/Thin film deposition/thermalevaporator: Difference between revisions

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'''Feedback to this page''': '''[mailto:pvd@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Alcatel&action=edit click here]'''  
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[[Category: Equipment|Thin film]]
[[Category: Equipment|Thin film]]
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'''The user manual, quality control procedure and results, user APV, technical information and contact information can be found in LabManager:'''  
'''The user manual, APV, technical information and contact information can be found in LabManager:'''  
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<!-- give the link to the equipment info page in LabManager: -->
<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=20 Alcatel in LabManager]
[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=404 Thermal Evaporator in LabManager]


<br clear="all" />
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==Process information==
==Process information==
====Materials for e-beam evaporation====
====Materials for thermal evaporator evaporation====


*[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium|Aluminium (Al)]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Aluminium|Aluminium]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Chromium|Chromium (Cr)]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Silver|Silver]]  
*[[Specific Process Knowledge/Thin film deposition/Deposition of Copper|Copper (Cu)]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Germanium|Germanium]]  
*[[Specific Process Knowledge/Thin film deposition/Deposition of Gold|Gold (Au)]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Molybdenum|Molybdenum (Mo)]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Nickel|Nickel (Ni)]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Palladium|Palladium (Pd)]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Platinum|Platinum (Pt)]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Silver|Silver (Ag)]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Tantalum|Tantalum (Ta)]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Tin|Tin (Sn)]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of Titanium|Titanium (Ti)]]  
*[[Specific Process Knowledge/Thin film deposition/Deposition of Tungsten|Tungsten (W)]] - thinner layers




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!style="background:silver; color:black;" align="left"|Purpose  
!style="background:silver; color:black;" align="left"|Purpose  
|style="background:LightGrey; color:black"|Deposition of metals and silicon ||style="background:WhiteSmoke; color:black"|
|style="background:LightGrey; color:black"|Deposition of metals and silicon ||style="background:WhiteSmoke; color:black"|
*E-beam evaporation of metals
*Thermal evaporation of metals
*Sputtering of Silicon
|-
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Performance
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Performance
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|style="background:LightGrey; color:black"|Deposition rate
|style="background:LightGrey; color:black"|Deposition rate
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*2Å/s - 15Å/s
*0.5 Å/s - 5 Å/s (material dependens)
|-
|-
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Process parameter range
!style="background:silver; color:black" align="left" valign="top" rowspan="2"|Process parameter range
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|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*One 4" wafer per run
*Up to 8" wafer
*Or several smaller pieces
*Or several smaller pieces
*Deposition on one side of the substrate
*Deposition on one side of the substrate

Revision as of 16:17, 12 October 2017

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Alcatel - A system for deposition of metals

positioned in cleanroom A-1.



The user manual, APV, technical information and contact information can be found in LabManager:

Thermal Evaporator in LabManager


Process information

Materials for thermal evaporator evaporation


Equipment performance and process related parameters Alcatel

Purpose Deposition of metals and silicon
  • Thermal evaporation of metals
Performance Film thickness
  • 10Å - 1µm* (for some materials)
Deposition rate
  • 0.5 Å/s - 5 Å/s (material dependens)
Process parameter range Process Temperature
  • Approximately room temperature
Process pressure
  • Low than 4*10-6 mbar
Substrates Batch size
  • Up to 8" wafer
  • Or several smaller pieces
  • Deposition on one side of the substrate
Substrate material allowed
  • Silicon wafers
  • Quartz wafers
  • Pyrex wafers
Material allowed on the substrate
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • Metals

* For thicknesses above 200 nm permission is requested.

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