Specific Process Knowledge/Thin film deposition: Difference between revisions
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*[[/Black Magic PECVD|Black Magic PECVD]] - ''Black Magic PECVD (Carbon)'' | *[[/Black Magic PECVD|Black Magic PECVD]] - ''Black Magic PECVD (Carbon)'' | ||
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*[[/ALD Picosun R200|ALD Picosun R200]] - Atomic Layer Deposition | *[[/ALD Picosun R200|ALD Picosun R200]] - Thermal atomic layer deposition | ||
*[[/ALD2 (PEALD)|ALD2 (PEALD)]] - | *[[/ALD Picosun R200|ALD1]] - Atomic Layer Deposition (thermal) | ||
*[[/ALD2 (PEALD)|ALD2 (PEALD)]] - Atomic Layer Deposition (thermal and plasma enhanced) | |||
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See the [[Specific Process Knowledge/Lithography/Coaters |Lithography/Coaters]] page for coating polymers | See the [[Specific Process Knowledge/Lithography/Coaters |Lithography/Coaters]] page for coating polymers |
Revision as of 14:16, 5 January 2018
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Choose material to deposit
Dielectrica | Semicondutors | Metals | Alloys | Transparent conductive oxides | Polymers |
Silicon Nitride - and oxynitride |
Aluminium |
TiW alloy (10%/90% by weight) |
ITO (Tin doped Indium Oxide) |
SU-8 |
Choose deposition equipment
PVD | LPCVD | PECVD | ALD | Coaters | Others
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See the Lithography/Coaters page for coating polymers |
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