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Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,567 edits
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|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6_-_2|Aligner: MA6 - 2]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner:_MA6_-_2|Aligner: MA6 - 2]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner-6inch|Aligner: 6inch]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner-6inch|Aligner: 6inch]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#III-V Aligner|III-V Aligner]] <span style="color:#FF0000">DECOMISSIONED!</span></b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Aligner: Maskless 01|Aligner: Maskless 01]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Inclined UV Lamp|Inclined UV Lamp]]</b>
|style="background:WhiteSmoke; color:black"|<b>[[Specific_Process_Knowledge/Lithography/UVExposure#Inclined UV Lamp|Inclined UV Lamp]]</b>


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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Top Side Alignment
*Top Side Alignment
*UV exposure
*Direct UV writing
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*UV exposure
*UV exposure
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*1.25µm  
*1.25µm  
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*2µm
*3µm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
|-
|-
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|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*350W Hg lamp
*365nm LED
*the entire 350W Hg-lamp spectrum, intensity in Constant Power mode: 5mW/cm<sup>2</sup> @ 365nm
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1000 W Hg-Xe lamp
*1000 W Hg-Xe lamp
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*proximity, soft, hard, vacuum contact  
*proximity, soft, hard, vacuum contact  
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*proximity, soft, hard, vacuum contact
*Direct writing
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Flood exposure
*Flood exposure
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*1-25 150 mm wafers with automatic handling
*1-25 150 mm wafers with automatic handling
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1 small sample
*1 small sample, down to 5x5 mm<sup>2</sup>
*1 50 mm wafer
*1 50 mm wafer
*1 100 mm wafer
*1 100 mm wafer
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*All cleanroom materials except III-V materials, copper and steel substrates, and type IV films
*All cleanroom materials except III-V materials, copper and steel substrates, and type IV films
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*III-V compounds
*Silicon
*Glass
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*All cleanroom materials
*All cleanroom materials
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